Microwave Dielectric Ceramics and Applications

Microwave dielectric ceramics play a key role in the evaluation of wireless communication technology because of their important applications as microwave/millimeter-wave resonators, filters, antennas, microwave attenuation and shielding, etc. On the other hand, new devices with superior performance are currently being developed to respond to the requirement of increased channel capacity in ground-based cellular and satellite communications. Device performance is closely related to material properties. In order to meet the needs of present and future microwave systems, improved or new components based on microwave dielectric ceramics and new designs are required. This symposium provides a forum for the worldwide microwave communities from academia and industry to share their vision and insights for microwave dielectric ceramics, to boost the research and development of microwave dielectric ceramics and promote their applications in 5G/6G, V2X, satellite communication/navigation and other information systems. 

Proposed sessions

ª Novel microwave and millimeter-wave dielectric ceramics

ª LTCC/ULTCC materials

ª Cold sintering and other novel process for ceramics preparation

ª Components/devices/microsystems based on microwave dielectric ceramics

ª Metamaterials, metasurface and advanced artificial structures

ª Microwave dielectric ceramics and devices esign/ modeling/ simulation/ measurements

ª 3D printing /photolithography and other emerging microwave/millimeter wave             devices fabrication/integration technologies

ª Microwave circuits package and integration

ª Other microwave dielectric materials related emerging topics

Organizers

- Hong Wang (Points of contact), Southern University of Science and Technology,     China, wangh6@sustech.edu.cn

- Zhifu Liu (Points of contact), Shanghai Institute of Ceramics, Chinese Academy
   of Sciences, China, liuzf@mail.sic.ac.cn

- Eung Soo Kim (Points of contact), Kyonggi University, Korea, eskim@kyonggi.ac.kr

- Xiangming Chen, Zhejiang University, China

- Heli Jantunen, University of Oulu, Finland 

- Hanxing Liu, Wuhan University of Technology, China 

- Feng Shi, Qilu University of Technology, China 

- Xiaoxiao Huang, Harbin Institute of Technology, China