Ceramic Integration and Joining Technologies

The functional and economic impacts of ceramic materials are historically related to their integration and joining technologies that connect innovation in ceramics with manufacturing. Reliably integrating ceramics into products of very large or small sizes, and complex shapes or functions is a must to facilitate these emerging ceramic applications. Therefore, the integration and joining of ceramics have received increasing attention in many fields such as aerospace, aviation, nuclear energy, batteries, thermoelectric devices, medical treatment, and microelectronics. The joining of ceramic to itself or metal can be realized by using a variety of methods, such as diffusion bonding, brazing, soldering, hot pressing reaction sintering joining, self-propagating high-temperature synthesis joining, riveting, packaging, and chemical vapor deposition. The symposium provides a forum for researchers to share state-of-the-art ideas about the technical issues, challenges, perspectives, and opportunities in ceramic joining and integration. This symposium will discuss current computational and experimental studies in areas such as ceramic joining and integration technologies, microstructure-interface physical evolution-property relationships, ceramic assemblies’ reliability, and performance, with the ultimate goal of being application-oriented.

Proposed sessions

ª Ceramic joining to itself or metal

ª Ceramic riveting and bonding   

ª Ceramic packaging for device fabrication   

ª Micro- or Nano-integration for ceramic

ª Green ceramic joining or integration materials and equipment development

ª Processing, properties, and evolution of ceramic surface and interface

ª Modeling and theory computation of ceramic joining and integration

ª Performance and reliability of ceramic assemblies in the working environments

Organizers

- Tiesong Lin (Points of Contact), Harbin Institute of Technology, China, tiesonglin@hit.edu.cn

- Rajiv Asthana (Points of Contact), University of Wisconsin-Stout, USA, asthanar@uwstout.edu

- Heli Jantunen, University of Oulu, Finland

- Fei Shen Ong, The University of Tokyo, Japan

- Fabiana D'Isanto, Politecnico di Torino, Italy

- Mrityunjay Singh, Ohio Aerospace Institute, USA

- Yan Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China

- Jian Cao, Harbin Institute of Technology, China

- Zhenwen Yang, Tianjin University, China

- Lei Liu, Tsinghua University, China 

- Dehua Xiong, Wuhan University of Technology, China

- Xiaobing Zhou, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences,
   China

- Xiaoguo Song, Harbin Institute of Technoloy, Weihai, China

Point of Contact Assistant

* Liangbo Sun, Harbin Institute of Technology, China, sunliangbo@hit.edu.cn